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The Packaging Power Play in AI Chips | Hartford News
Description
The AI boom is hitting a hidden bottleneck: advanced chip packaging. While shrinking transistors isn’t enough for AI’s power demands, the U.S. has fallen behind Taiwan’s TSMC, which dominates both chipmaking and packaging—with most suppliers also in Taiwan. Former IBM guru Subramanian Iyer warns that U.S. investments like the shuttered Arizona packaging center have backfired, deepening dependency. Now, Intel, Applied Materials, and Amkor are racing to build U.S. packaging capacity, with Nvidia and Apple backing domestic efforts. With AI demand soaring, packaging isn’t just supporting—it’s becoming the critical next frontier in semiconductor leadership.
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