Episode Details
Back to EpisodesGoogle's AI Vision Rethink of Package Testing for Shock & Vibes: Packaging World
Season 2
Episode 71
Published 4 months, 1 week ago
Description
How are new tools, in conjunction with AI, helping engineers at Google?
Packaging World Editor-in-Chief Matt Reynolds sits down with Ken Leung,
Senior Mechanical Engineer at Google, to discuss high-speed imaging and AI-driven analysis for packaged data center hardware. Leung explains why traditional testing methods may be missing the point because of changes to the products they're meant to protect.
Read the full featured article on Packaging World.