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Can Huawei's New Chip Strategy Outpace U.S. Sanctions?
Description
Huawei announces a new semiconductor strategy called LogicFolding to enhance Kirin smartphone chips, aiming to bypass U.S. sanctions and intensify competition with Nvidia and Apple. Huawei plans to achieve 1.4-nanometer process technology capabilities by 2031, while TSMC begins producing 2-nanometer chips. Industry experts express skepticism about achieving true 1.4-nanometer manufacturing due to power and thermal challenges. Huawei's Mate 60 smartphone, introduced in 2023, marked a step in regaining market share from Apple. The company seeks academic recognition with its 'Law of Tau' to address semiconductor industry challenges, though its approach remains unproven at scale.
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