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#706 – Leading Edge Analog with Joren Vaes



Welcome Joren Vaes, design engineer at SOFICS

  • Simulation is critical when designing analog devices based on a PDK from the fab
  • Parasitics are significant, especially with new nodes having upwards of 16 metal layers
  • Chris complained about a class where the professor made them draw planar structures with graph paper with colored pencils
  • Large fabs on leading edge nodes have 1800 page textbook of rules
  • Because the constraints get tighter, that book gets longer for each node
  • 2 nm mass production on finfet currently with TSMC
  • 22 was the last classic cmos
  • Finfet, looks like a devil
  • ‘gate all around’ / nanosheet
  • CFET (complementary field effect transistor) is next
  • Joren really gets Maxwells Equations…as you have to at super high speeds
  • SOFICS are making phy’s / IP blocks
  • Amplifiers that are DC to 50 GHz
  • Making a datasheet for the resulting IP block
  • Joren got his PhD working on millimeter wave applications
  • It’s all just physics
  • Using coils to impedance match between layers
  • Reflecting off of different materials at angles is Snells law (not lorentz equation) and that extends to different materials at different wavelengths
  • Cables are very lossy at 100 GHz…dBs per cm
  • Parasitics impact every part of the design process
  • Wireline community – name for the high speed interfaces, including research in the space
  • Most transistor threshhold voltages that Joren works with are … 750 mV!
  • Voltage dependent drc rules
  • Electromigration – holes in wires from electrons
  • ESD is a big part of the business, and a large source of parasitics
  • New product development for IP blocks
  • Working with customers and Foundry at the 2 nm node
  • Design companies need to be paying 100s of thousands to software providers
  • After, it goes to spice and schedmatic
  • Joren decides whether to jump in on layout
  • LVS – layout vs schematic
  • Parasitic extraction (spice netlist)
  • PDKs define how you can do the layout stage
  • Lower cost tools exist but more expensive tools have tooling that tells you when you’re violating DRC
  • 3 main vendors
    • Cadence
    • Synopsis
    • Siemens (Calibre)
  • Foundries soemtimes only support one tool
  • Doing test wafers  allows testing of structures. They often get MPW at a discount from the fab (since they’re often testing new processes as well)
  • How do they test with packaging options?
    • ‘low speed’ can be die bonded or pcb mounted
    • high speed does on wafer probing (with veeeery expensive probes)
  • Check out Sofics.com for more info on the company. Published on 3 weeks, 1 day ago






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