Episode Details

Back to Episodes

How the U.S. Government Is Innovating in Its Efforts to Fund Semiconductor Manufacturing

Episode 238 Published 2 years, 1 month ago
Description

In February 2023, U.S. Commerce Secretary Gina Raimondo was deciding whether or not to sign off on a Notice of Funding Opportunity (NOFO) for $39 billion in direct semiconductor manufacturing incentives. But this NOFO had several unconventional provisions: a pre-application (pre-app) to the actual application, upside sharing provisions to align incentives, and funding milestones so that only awardees making progress would receive additional funds.

The funding had been made available through the U.S. Department of Commerce by the CHIPS (Creating Helpful Incentives to Produce Semiconductors) and Science Act passed a few months earlier. Raimondo’s team had proposed additional measures that would help the U.S. regain technological leadership while protecting taxpayer funds. Should Raimondo move forward with the “innovative” NOFO, despite the risks?

Harvard Business School professor Mitch Weiss explores the issue of risk-taking and innovation in government in his case, “The CHIPs Program Office.”

Listen Now

Love PodBriefly?

If you like Podbriefly.com, please consider donating to support the ongoing development.

Support Us